Integrated magnetic sensor component

A sensor component for measuring a magnetic field strength wherein the sensor component comprises:

• a plurality of leads:
• a sensor semiconductor chip configured to measure the magnetic field strength wherein the sensor semiconductor chip has pads on its active upper side and the pads are electrically connected to the leads;
• a magnet attached to the leads, wherein the sensor semiconductor chip is arranged on an upper side of the magnet;
• and
• first mold compound, which shares a common boundary with the sensor semiconductor chip, and surrounds the sensor semiconductor chip, the magnet and parts of the lead, wherein the first mold compound is surrounded by a further mold compound consisting of a thermoplastic.

A sensor component for measuring a magnetic field strength, wherein the sensor component comprises:

• a plurality of leads;
• a sensor semiconductor chip configured to measure the magnetic field strength, wherein the sensor semiconductor chip has pads on its active upper side and the pads are electrically connected to the leads;
• a magnet attached to the leads, wherein the sensor semiconductor chip is arranged on an upper side of the magnet;
• and
• first mold compound, which shares a common boundary with the sensor semiconductor chip, and surrounds the sensor semiconductor chip, the magnet and parts of the lead, wherein the leads are connected electrically to a cable and the connection points between the leads and the cable are surrounded by the first mold compound.

A method for manufacturing a sensor component for measuring a magnetic field strength, comprising:

• providing of a plurality of leads;
• providing of a magnet;
• providing of a sensor semiconductor chip configured to measure the magnetic field strength, wherein the sensor semiconductor chip has pads on its active upper side;
• securing the magnet to the leads;
• arranging the sensor semiconductor chip on an upper side of the magnet;
• electrical connection of the pads of the sensor semiconductor chip to the leads;
• and
• enclosing the magnet, the sensor semiconductor chip and parts of the leads with a first mold compound so that the first mold compound shares a common boundary with the sensor semiconductor chip, wherein the sensor component is sprayed, with a further mold compound consisting of a thermoplastic.

A method for manufucturing a sensor component for measuring a magnetic field strength, comprising:

• providing of a plurality of leads;
• providing of a magnet;
• providing of a sensor semiconductor chip configured to measure the magnetic field strength, wherein the sensor semiconductor chip has pads on its active upper side;
• securing the magnet to the leads;
• arranging the sensor semiconductor chip on an upper side of the magnet;
• electrical connection of the pads of the sensor semiconductor chip to the leads;
• and
• enclosing the magnet, the sensor semiconductor chip and parts of the leads with a first mold compound so that the first mold compound shares a common boundary with the sensor semiconductor chip, wherein a soft magnetic honmogenizing plate is fitted between the sensor semiconductor chip and the magnet, and the soft magnetic homogenizing plate is also enclosed by the first mold compound.