Multiple wavelength sensor interconnect

A sensor interconnect assembly comprising:

• a circuit substrate;
• an emitter portion of the substrate adapted to mount a plurality of emitters;
• a detector portion of the substrate adapted to mount a detector;
• a cable portion of the substrate adapted to connect a sensor cable;
• a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion;
• a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion:
• a decoupling portion of the substrate disposed proximate the cable portion substantially mechanically decoupling cable stiffness associated with the cable portion from one or more of the emitter portion and the detector portion;
• and
• a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

A sensor interconnect assembly which mechanically decouples cable stress from one or more of first and second pluralities of conductors, the sensor interconnect assembly comprising:

• a circuit substrate including an elongate portion;
• an emitter portion of the substrate adapted to mount a plurality of emitters;
• a detector portion of the substrate adapted to mount a detector;
• a cable portion of the substrate adapted to connect a sensor cable;
• a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;
• a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed along the elongate portion of the substrate;
• and
• a decoupling portion of the substrate disposed between the cable portion, the elongate portion, and one or more of the emitter portion and the detector portion, the decoupling portion forming a narrowing of the substrate.

A sensor interconnect assembly which mechanically decouples cable stiffness from one or more of an emitter portion and a detector portion, the sensor interconnect assembly comprising:

• a circuit substrate;
• an emitter portion of the substrate adapted to mount a plurality of emitters;
• a detector portion of the substrate adapted to mount a detector;
• a cable portion of the substrate adapted to connect a sensor cable;
• a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion;
• a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion;
• and
• a decoupling portion of the substrate disposed between the cable portion and one or more of the emitter portion and the detector portion, the decoupling portion forming a narrowing of the substrate;
• and
• a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

A sensor interconnect assembly comprising:

• a circuit substrate including an elongate portion;
• an emitter portion of the substrate adapted to mount a plurality of emitters;
• a detector portion of the substrate adapted to mount a detector;
• a cable portion of the substrate adapted to connect a sensor cable;
• a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;
• a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed along the elongate portion of the substrate;
• and
• a decoupling portion of the substrate extending perpendicular to the elongate portion and connecting the elongate portion and the cable portion, wherein the decoupling portion substantially mechanically decouples stress associated with the cable portion from one or more of the first and second pluralities of conductors along the elongate portion of the substrate.