Negative photoresist composition
AssigneeIndustrial Technology Research Institute
InventorsJyh-Long Jeng, Jeng-Yu Tsai, Charng-Shing Lu, Jinn-Shing King
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Abstract
The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C═C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.
Claims10
A negative photoresist composition comprising the following components dissolved in a solvent:
- a) a polyimide having the following chemical structure (I);
- b) an unsaturated vinyl monomer that contains a tertiary amino group;
- and c) a photoinitiator, wherein an amount of the photoinitiator c) is 0.1-30% based on the weigh of the solid content of the polyimide (I), an amount of the monomer b) is 70-130% of moles of carboxyl group contained in the polyimide (I),
- wherein
- Ar1 is a tetra-valent radical;
- Ar2 is a bivalent radical;
- Ar3 is a bivalent radical that contains a carboxyl group;
- Ar4 is a bivalent radical that contains —CH2—C(OH)H—CH2—O—C(O)—C(R)═CH;
- in which R is H or a methyl group;
- m+n+o=1,0.1≦n+o≦0.6, and n:o=9:1˜4:6.
Dependencies are inferred from the claim text.