Photosensitive resins, resin compositions and products of curing thereof
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsHiroo Koyanagi, Koji Nakayama, Chie Umeyama, Yoshihiro Kawada, Minoru Yokoshima
Life of this patent
Estimating the term…
Loading patent…
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsHiroo Koyanagi, Koji Nakayama, Chie Umeyama, Yoshihiro Kawada, Minoru Yokoshima
Estimating the term…
A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.
A photosensitive resin composition comprising a photosensitive resin (A) comprising a carboxyl group-containing (meth)acrylate oligomer (A′) which is a reaction product between a carboxyl group-containing polyester compound (c′) and a compound (d′) that has a (meth)acryloyl group and an epoxy group in a molecule, wherein said compound (d′) is glycidyl (meth)acrylate, and wherein the polyester compound (c′) is a reaction product between a diol compound (a′) having an alicyclic structure and tetra-basic acid dianhydride (b), a photopolymerization initiator (C) and a diluent (XX) or a crosslinking agent (B).
An alkali-soluble and photosensitive resin (AA), comprising a reaction product obtained by allowing further reacting di-basic acid or tri-basic acid monoanhydride (e) to a photosensitive resin (A) comprising a reaction product between a polyester compound (c) that is a reaction product between a polyol compound (a) and tetra-basic acid dianhydride (b) and a compound (d) having an ethylenic unsaturated group and an epoxy group in a molecule.
Dependencies are inferred from the claim text.