Diffusion bonding for metallic membrane joining with metallic module
AssigneeMembrane Reactor Technologies Ltd.
InventorAnwu Li
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Abstract
This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.
Claims8
A method of bonding a metallic membrane with a metallic part comprising:
- directly physically contacting a smooth surface of a metallic membrane comprising palladium against a smooth surface of the metallic pan without any intervening material being present between the two contacting surfaces and mechanically pressing the metallic membrane and the metallic part together at a pressure in the range of about 1,000 psig to about 3,000 psig;
- heating the directly physically contacting metallic membrane comprising palladium and the metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a reducing gas atmosphere.
Dependencies are inferred from the claim text.