Semiconductor device and a method for manufacturing the same

A semiconductor device comprising:

• a first substrate having a top surface and a rear surface;
• a second substrate having a top surface and a rear surface;
• a first semiconductor chip disposed over the top surface of the first substrate between the top surface of the first substrate and the top surface of the second substrate;
• first terminals disposed over the rear surface of the first substrate and electrically connected to the first semiconductor chip;
• second terminals disposed over the rear surface of the second substrate and electrically connected to the first semiconductor chip;
• first wires electrically connected to the first semiconductor chip and to the first and second terminals;
• second wires electrically connected to the first semiconductor chip and to the second terminals;
• and
• a resin covering parts of the first wires, the second wires and the first semiconductor chip,
• wherein the first wires are partially exposed from the top surface of the resin,
• wherein a height of the first wires is higher than a height of the second wires based on the top surface of the first substrate,
• wherein the second terminals are provided in accordance with a mini-UICC standard, and
• wherein the first terminals provide an interface for a memory stick device, a multi-media card, an SD card, or a USB.