Flip chip heat sink package and method

A method for providing at least two discrete thermal conductive paths for a plurality of semi-conductor devices of an electronic package, the method comprising:

• securing a substrate of the electronic package to a thermally conductive case having a plurality of cooling fins and a peripheral wall, the peripheral wall defining a perimeter of an area receiving the substrate, the substrate having a plurality of thermally conductive vias passing therethrough, the plurality of thermally conductive vias providing a thermal path from one side of the substrate to another side of the substrate;
• mounting the plurality of semi-conductor devices to the substrate, each of the plurality of semi-conductor devices having a first surface, a plurality of solder bumps on the first surface, and a second surface oppositely disposed from the first surface, each of the plurality of semi-conductor devices being mounted to the substrate such that the plurality solder bumps are registered with a respective group of the plurality of thermally conductive vias;
• attaching a heat sink cover to the thermally conductive case, the heat cover having a plurality of cavities each being in heat transfer relationship with respect to the second surface of a respective one of the plurality of semi-conductor devices, the thermally conductive case providing a first thermal conductive path for each of the plurality of semi-conductor device via the plurality of thermally conductive vias and the heat sink cover providing a second thermal conductive path for each of the plurality of semi-conductor devices via a respective one of the plurality of cavities;
• and
• filling each of the plurality of cavities with a thermally conductive material.