Cooling device and electronic apparatus
AssigneeKabushiki Kaisha Toshiba
InventorKentaro Tomioka
Life of this patent
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Abstract
According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.
Claims18
A cooling device comprising:
- a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including (i) a passage through which a coolant circulates, (ii) a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, (iii) a heat-sinking section that dissipates heat received by the heat-receiving section, (iv) a first plate member in which is formed a first groove corresponding to the passage, (v) a second plate member that covers the first groove, and (vi) a third plate member coupled to at least one of the first and second plate members, the third plate member includes partition wall sections that extend toward and are connected to one of the first and second plate members, and a hermetic space is defined by the partition wall sections and the one of the first and second plate members;
- wherein the heat-receiving section is formed at least one of the first and second plate members.
An electronic apparatus comprising:
- a casing;
- first and second heating elements housed in the casing;
- and
- a cooling device that cools the first and second heating elements, the cooling device comprising:
- a heat transfer unit thermally connected to the mounted first heating element and the mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, a second plate member that covers the first groove, and a third plate member coupled to at least one of the first and second plate members, the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and the one of the first and second plate members, the partition wall sections being connected to at least one of the first and second plate members;
- wherein the heat-receiving section is formed at least one of the first and second plate members.
Dependencies are inferred from the claim text.