Image sensor module and method of making the same
AssigneeRohm Co., Ltd.
InventorsHisayoshi Fujimoto, Hiroaki Onishi
Life of this patent
Estimating the term…
Abstract
An image sensor module includes a holder and a lens unit attached in the holder. The lens unit is held in the holder by at least one engagement projection formed by plastically deforming a part of the holder. Preferably, the lens unit includes a first lens spaced from the engagement projection and a second lens adjoining the engagement projection. Each of the first lens and the second lens includes a central lens portion, and a flat peripheral portion surrounding the lens portion. The flat peripheral portion of the first lens is held in contact with the flat peripheral portion of the second lens. The engagement projection engages the flat peripheral portion of the second lens.
Claims11
An image sensor module comprising:
- a holder;
- a lens unit attached in the holder and having a focal point;
- a frame attached to the holder;
- a substrate supported by the frame;
- and an image sensor chip mounted on the substrate, the image sensor chip provided with a light receiving portion facing the lens unit;
- the lens unit held in the holder by at least one engagement projection formed by plastically deforming a part of the holder, and
- the holder comprising at least one tapered fusion projection, the tapered fusion projection being pointed toward the frame and subjected to thermal fusing to attach the holder to the frame and an application of ultrasonic energy to plastically deform the tapered projection, the thermal fusing and plastic deformation of the tapered fusion projection being performed until the focal point of the lens unit corresponds to the light receiving portion of the image sensor chip.
A method of making an image sensor module which includes a holder, a lens unit attached in the holder, and a frame attached to the holder;
- the method comprising the steps of:
- plastically deforming a part of the holder to form at least one engagement projection for holding the lens unit in the holder;
- and
- attaching the frame to the holder by thermally fusing a tapered projection of the holder pointing toward the frame and applying ultrasonic energy to the tapered projection to plastically deform the tapered projection;
- wherein the frame supports a substrate on which an image sensor chip is mounted to face the lens unit, and the thermal fusing of the tapered projection and plastically deforming are performed until a focal point of the lens unit corresponds to a light receiving portion of the image sensor chip.
Dependencies are inferred from the claim text.