Chip resistor
AssigneeRohm Co., Ltd.
InventorMasanori Tanimura
Life of this patent
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Abstract
The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.
Claims3
A chip resistor comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- a pair of thick first electrodes made of a metal organic paste on the first surface of the material substrate;
- a pair of thick second electrodes made from a metal organic paste on the second surface of the material substrate;
- and
- a thin film resistor element connecting between the paired first electrodes on the first surface of the material substrate,
- wherein the thin film resistor element has a pair of lifted end portions formed over the pair of first electrodes and entirely covering the pair of first electrodes.
Dependencies are inferred from the claim text.