Transceiver using low temperature co-fired ceramic method
AssigneeElectronics and Telecommunications Research Institute
InventorsBong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song
Life of this patent
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Abstract
Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
Claims10
A transceiver using a low temperature co-fired ceramic (LTCC) method, comprising:
- a multilayer substrate including:
- a lowest ground plane;
- a highest ground plane;
- a plurality of interior ground planes;
- a plurality of dielectric layers sandwiched between all of the ground planes;
- a plurality of ground side walls connecting together the lowest ground plane to the highest ground plane;
- and
- a pad for input/output of a bias on a lowest ground plane;
- a plurality of ground vias interconnecting together all of the ground planes of the multilayer substrate;
- an amplifier mounted to the multilayer substrate within a cavity;
- a mixer mounted onto the multilayer substrate within another cavity;
- and
- a filter mounted onto the multilayer substrate, the filter having a strip line between the amplifier and the mixer.
Dependencies are inferred from the claim text.