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US 7,352,067 B2Granted
Stacked semiconductor device
AssigneesNEC Corporation, Elpida Memory, Inc.
InventorsMuneo Fukaishi, Hideaki Saito, Yasuhiko Hagihara, Masayuki Mizuno, Hiroaki Ikeda, Kayoko Shibata
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Abstract
A stacked semiconductor device includes a plurality of semiconductor chips and a conductive path extending through at least one of the semiconductor chips. The semiconductor chips are stacked together. The semiconductor chips are electrically connected by the conductive path, and the conductive path has a plurality of through-connections extending through the corresponding semiconductor chip.
Claims15
A stacked semiconductor device comprising:
- a plurality of semiconductor chips, said semiconductor chips being stacked together;
- and
- a conductive path from a first terminal to a second terminal extending through at least one of said semiconductor chips;
- wherein said semiconductor chips are electrically connected by said conductive path, and each conductive path has a plurality of through-connections extending through the at least one semiconductor chip;
- and
- wherein each of the plurality of through-connections is routed through a through-via, said through-via comprising a hole in the at least one semiconductor chip.
3 more elements
Dependencies are inferred from the claim text.