Integrated circuit package design
AssigneeLSI Logic Corporation
InventorsMukul A. Joshi, Mohan R. Nagar, Sarathy Rajagopalan
Life of this patent
Estimating the term…
Abstract
A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.
Claims20
A packaged integrated circuit, comprising:
- a package substrate having electrical contacts for receiving an integrated circuit,
- the integrated circuit electrically connected to the electrical contacts of the package substrate, the integrated circuit having corners and sides,
- a stiffener mounted to the package substrate, the stiffener having a non-orthogonal cut out in which the integrated circuit is disposed, the cut out having edges, the edges of the cut out disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit, and
- a heat spreader thermally connected to the integrated circuit.
A packaged integrated circuit, comprising:
- a package substrate having electrical contacts for receiving an integrated circuit, and a recessed portion at a periphreal edge of the package substrate for receiving a heat spreader,
- the integrated circuit electrically connected to the electrical contacts of the package substrate, the integrated circuit having corners and sides, and
- the heat spreader thermally connected to the integrated circuit, the heat spreader mounted within the recessed portion at the peripheral edge of the package substrate.
A packaged integrated circuit, comprising:
- a package substrate having electrical contacts for receiving an integrated circuit,
- the integrated circuit electrically connected to the electrical contacts of the package substrate, the integrated circuit having corners and sides, and
- a stiffener mounted to the package substrate, the stiffener having a non-orthogonal cut out in which the integrated circuit is disposed, the cut out having edges, the edges of the cut out disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.
Dependencies are inferred from the claim text.