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US 7,352,056 B2Granted
Semiconductor package structure with microstrip antennan
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorSung-Mao Wu
Life of this patent
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Abstract
A semiconductor package structure with a microstrip antenna comprises a packaging substrate, a chip and a microstrip radiation device. The packaging substrate has an upper surface having a packaging area on which the chip is disposed and a peripheral area on which the microstrip radiation device is disposed for transceiving a signal of the chip.
Claims16
A semiconductor package with a microstrip antenna, comprising:
- a carrier, having an upper surface with a packaging area and a peripheral area surrounding the packaging area, wherein the packaging area has a plurality of contacts formed thereon;
- a chip, attached on the packaging area and electrically connected to the contacts;
- and
- a microstrip device, disposed on the peripheral area for transceiving a wireless signal of the chip.
1 more element
A substrate structure having a microstrip antenna, comprising:
- a substrate, having a lower surface and an upper surface with a packaging area and a microstrip disposal area, wherein the packaging area has a plurality of contacts formed thereon;
- and
- a microstrip device, disposed on the microstrip disposal area for receiving a wireless signal transmitted from the chip.
Dependencies are inferred from the claim text.