Semiconductor package with controlled solder bump wetting
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Kwon Shim, Sheila Marie L. Alvarez, Sheila Rima C. Magno
Life of this patent
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Abstract
A semiconductor package includes a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plurality of solder bumps is attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps. An encapsulant encapsulates the die, the electrical connections, and the plurality of lead fingers to expose a lower surface of the plurality of lead fingers. The plurality of stud bumps may include a plurality of clusters of stud bumps.
Claims6
A semiconductor package, comprising:
- a substrate having a plurality of lead fingers;
- a plurality of stud bumps attached to the plurality of lead fingers, the plurality of stud bumps comprises a plurality of clusters of stud bumps, and the plurality of clusters of stud bumps comprise at least two stud bumps;
- a die having a plurality solder bumps;
- the plurality of solder bumps attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps;
- and
- an encapsulant encapsulating the die, the electrical connections, and the lead fingers to expose a lower surface of the plurality of lead fingers.
A semiconductor package, comprising:
- a leadframe having a plurality of lead fingers;
- a plurality of stud bumps, made from bond wire, attached to the plurality of lead fingers;
- a die having a plurality solder bumps;
- the plurality of solder bumps vertically aligned with and attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps, the plurality of stud bumps comprises a plurality of clusters of stud bumps, the plurality of clusters of stud bumps comprise at least two stud bumps;
- and
- an encapsulant encapsulating the die, the electrical connections, and the lead fingers to expose a lower surface of the plurality of lead fingers.
Dependencies are inferred from the claim text.