Constructions comprising hafnium oxide
AssigneeMicron Technology, Inc.
InventorsCem Basceri, F. Daniel Gealy, Gurtej S. Sandhu
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AssigneeMicron Technology, Inc.
InventorsCem Basceri, F. Daniel Gealy, Gurtej S. Sandhu
Estimating the term…
The invention includes methods of forming hafnium-containing materials, such as, for example, hafnium oxide. In one aspect, a semiconductor substrate is provided, and first reaction conditions are utilized to form hafnium-containing seed material in a desired crystalline phase and orientation over the substrate. Subsequently, second reaction conditions are utilized to grow second hafnium-containing material over the seed material. The second hafnium-containing material is in a crystalline phase and/or orientation different from the crystalline phase and orientation of the hafnium-containing seed material. The second hafnium-containing material can be, for example, in an amorphous phase. The seed material is then utilized to induce a desired crystalline phase and orientation in the second hafnium-containing material. The invention also includes capacitor constructions utilizing hafnium-containing materials, and circuit assemblies comprising the capacitor constructions.
A DRAM construction comprising:
An electronic system comprising an array of memory cells, at least one of the memory cells of the array including a capacitor having a dielectric material between a pair of capacitor electrodes, with an entirety of the dielectric material between said pair of electrodes consisting essentially of crystalline hafnium oxide having a non-monoclinic crystallographic orientation.
Dependencies are inferred from the claim text.