All-reflective optical systems for broadband wafer inspection
AssigneeKLA-Tencor Technologies Corporation
InventorSteven R. Lange
Life of this patent
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AssigneeKLA-Tencor Technologies Corporation
InventorSteven R. Lange
Estimating the term…
All-reflective optical systems for broadband wafer inspection are provided. One system configured to inspect a wafer includes an optical subsystem. All light-directing components of the optical subsystem are reflective optical components except for one or more refractive optical components, which are located only in substantially collimated space. The refractive optical component(s) may include, for example, a refractive beamsplitter element that can be used to separate illumination and collection pupils. The optical subsystem may also include one or more reflective optical components located in substantially collimated space. The optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm. In some embodiments, the optical subsystem is configured for inspection of the wafer at wavelengths less than and greater than 200 nm.
A system configured to inspect a wafer, comprising an optical subsystem, wherein all light-directing optical components of the optical subsystem are reflective optical components except for one or more refractive optical components located only in substantially collimated space, wherein the optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm, and wherein a numerical aperture on the object side of the optical subsystem is greater than about 0.70.
A system configured to inspect a wafer, comprising a broadband optical subsystem, wherein all light-directing optical components of the broadband optical subsystem are reflective optical components except for one or more refractive optical components located only in substantially collimated space, wherein the broadband optical subsystem is configured for inspection of the wafer at wavelengths both less than and greater than 200 nm, and wherein a numerical aperture on the object side of the optical subsystem is greater than about 0.70.
A method for inspecting a wafer, comprising:
Dependencies are inferred from the claim text.