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AssigneeKoninklijke Philips Electronics N.V.
InventorAnton Petrus Maria Van Arendonk
Estimating the term…
The invention relates to a semiconductor device (10) comprising a semiconductor element (1), particularly a solid-state image sensor (1), comprising a semiconductor body (11) of which one surface comprises an optically active part (1A) and an optically inactive part (1B) within which electrical connection regions (2) of the optoelectronic semiconductor element (1) are present, while a body (3) is present above the optically active area (1A) of the surface of the semiconductor body (11) comprising an optical component (3B). According to the invention the body (3) comprises an optically transparent foil (3) which is present on the optically active part (1A) of the surface of the semiconductor body (11) and which is attached thereto with an optically transparent adhesive layer (4) and in which the optical component (3B) is formed. The device (10) is very stable, compact and easy to manufacture, that is to say in batches. For example a component (3B) such as a lens (3B) may easily be formed by pressing a suitably formed die (13) into the foil (3). A method according to the invention for manufacturing the device according to the invention is cost-effective and easy.
A semiconductor device comprising an optoelectronic semiconductor element comprising a semiconductor body, a surface of which has an optically active part and a non-optically active part, said non-optically active part comprising electrical connection areas of the optoelectronic semiconductor element, above which optically active part of the surface of the semiconductor body an optical body is located comprising an optical component, wherein the optical body comprises an optically transparent foil in which the optical component is formed that is located on the optically active part of the surface of the semiconductor body and is connected to it, and wherein the foil is connected to the surface of the semiconductor body by means of an optically transparent adhesive layer.
A method of manufacturing a semiconductor device comprising an optoelectronic semiconductor element with a semiconductor body of which one surface has an optically active part and an optically non-active part, said non-optically active part comprising electrical connection areas of the optoelectronic semiconductor element, above which optically active part of the surface of the semiconductor body an optical body is installed comprising an optical component, wherein the body is an optically transparent foil in which the optical component is formed that is installed on the optically active part of the surface of the semiconductor body and wherein the optical component is fixed to the surface of the semiconductor body by means of an optically transparent adhesive layer.
Dependencies are inferred from the claim text.