Thin circuit board
AssigneePhoenix Precision Technology Corporation
InventorShih-Ping Hsu
Life of this patent
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Abstract
A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer to electrically connect the circuit layer to the metal pad. A build-up circuit structure is formed on the surface of the dielectric layer where the circuit layer is formed, and a conductive element is formed on a surface of the metal pad, so as to form a single-sided build-up circuit structure that prevents the use of a core board. Therefore, the thickness of the circuit board can be reduced and the impedance of the circuit board can also be reduced due to elimination of the use of plated through holes.
Claims13
A thin circuit board, comprising:
- a dielectric layer with at least one cavity formed on a surface thereof without penetrating the dielectric layer;
- a metal pad formed in the cavity;
- a conductive element formed in the cavity and bonded to a surface of the metal pad;
- at least one circuit layer formed on another surface of the dielectric layer;
- a plurality of conductive vias formed in the dielectric layer for interconnecting the dielectric layer and the metal pad, so as for electrically connecting the circuit layer to the metal pad;
- a solder mask layer formed on the circuit layer and the surface of the dielectric layer;
- and
- a chip receiving area formed on the solder mask layer and having a plurality of openings to expose the circuit layer.
Dependencies are inferred from the claim text.