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US 7,351,915 B2Granted
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
Life of this patent
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Abstract
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
Claims8
A printed circuit board including an embedded capacitor having a high dielectric constant, comprising:
- a first insulating layer made of an insulating material to electrically insulate upper and lower parts from each other;
- a circuit layer made of a first conductive material, which is laminated on one side of the first insulating layer and in which circuit patterns including a plurality of lower electrodes of the embedded capacitors are formed;
- a plurality of second insulating layers laminated on the lower electrodes of the circuit layer, and made of a ceramic material;
- a plurality of upper electrodes laminated on the second insulating layers, and made of a second conductive material;
- a third insulating layer laminated on the circuit layer and upper electrodes, and including through holes for electrically connecting the upper electrodes to external elements;
- and
- a first adhesive metal layer made of a first adhesive metal providing interfacial adhesion on a first side of each of the plurality of second insulating layers, the first adhesive metal layer being disposed between the second insulating layers and the upper electrodes.
4 more elements
A printed circuit board including an embedded capacitor having a high dielectric constant, comprising:
- a first insulating layer made of a first insulating material to electrically insulate upper and lower parts from each other;
- a first circuit layer made of a first conductive material, which is laminated on one side of the first insulating layer, and in which first circuit patterns including a plurality of lower electrodes of the embedded capacitors are formed and a second insulating material is packed between the first circuit patterns;
- a second insulating layer continuously laminated on the first circuit layer, and made of a ceramic material;
- a second circuit layer made of a second conductive material, which is laminated on the second insulating layer, and in which second circuit patterns, including a plurality of upper electrodes corresponding to the lower electrodes, are formed;
- and
- a third insulating layer laminated on the second circuit layer, and including through holes for electrically connecting the upper electrodes to external elements.
3 more elements
Dependencies are inferred from the claim text.