Structure and method of forming capped chips
AssigneeTessera, Inc.
InventorsBelgacem Haba, Masud Beroz, Glenn Urbish, David B. Tuckerman
Life of this patent
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Abstract
As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.
Claims18
A method of forming a capped chip, said method comprising:
- forming a metal base pattern on a front surface of a chip;
- forming a cap, including:
- providing a mandrel having a depression formed in a surface thereof,
- applying an insulating coating atop said surface of said mandrel,
- removing a portion of said insulating coating to expose a region of said surface, the exposed region including the depression, and
- forming a metal layer atop only the exposed region of said surface including the depression;
- and
- joining said cap to said metal base pattern on said chip to form a capped chip such that said front surface of said chip remains uncovered from at least a contact of said chip to a peripheral edge of said chip.
A method of forming a capped chip, said method comprising:
- forming a respective metal base pattern on a front surface of each one of a plurality of chips, said plurality of chips being arranged according to a given array;
- patterning a metal sheet to form a cap frame that includes a plurality of caps, arranged according to the given array;
- and
- concurrently joining each one of said plurality of caps to corresponding ones of said plurality of chips to form a plurality of capped chips such that the front surface of each one of a plurality of chips remains uncovered from at least a contact of that chip to a peripheral edge of that chip.
Dependencies are inferred from the claim text.