Method of manufacturing thin film transistor substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsEou-sik Cho, Jang-soo Kim
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Abstract
A method of manufacturing a thin film transistor (TFT) substrate to minimize a rugged surface of an organic layer overlapping with a storage electrode is provided. The method includes forming a passivation layer on a substrate having a storage electrode and an organic layer covering the passivation layer, forming a concave portion by partially removing a portion of the organic layer that overlaps with the storage electrode, planarizing a rugged pattern located on the bottom of the concave portion, and forming an opening extending to a surface of the passivation layer by removing the planarized organic layer from the concave portion.
Claims26
A method of manufacturing a thin film transistor substrate, the method comprising:
- forming a passivation layer on a substrate having a storage electrode;
- forming an organic layer covering the passivation layer;
- forming a concave portion in the organic layer by partially removing a portion of the organic layer that overlaps the storage electrode;
- planarizing a rugged pattern located on a bottom surface of the concave portion;
- and
- forming an opening extending to a surface of the passivation layer by removing the planarized organic layer from the concave portion.
A method of manufacturing a thin film transistor substrate, the method comprising:
- forming a gate wire on a substrate, the gate wire comprising a gate line, a gate electrode and a storage electrode;
- forming a gate insulating layer covering the gate wire;
- forming a semiconductor layer and a data wire comprising a data line, a source electrode, and a drain electrode by sequentially forming an amorphous silicon layer and a data conductive layer on the gate insulating layer;
- forming a passivation layer on the data wire;
- forming an organic layer covering the passivation layer;
- forming a concave portion in the organic layer by partially removing a portion of the organic layer that overlaps the storage electrode;
- planarizing a rugged pattern located on a bottom surface of the concave portion;
- and
- forming an opening extending to a surface of the passivation layer by removing the planarized organic layer from the concave portion.
Dependencies are inferred from the claim text.