Method for fabricating quad flat non-leaded package
AssigneeAdvance Semiconductor Engineering Inc.
InventorYung-Feng Gai
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Abstract
The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spatially disposed around the chip pedestal. An upper mold corresponding to the lower mold is provided over the lead frame for encapsulation. The upper mold is pressed to form a protrusion from a resilient film between the chip pedestal and the pins, and then the chip pedestal and the pins are encapsulated by a molding material. The resilient film is removed to form a QFN structure with the lead frame protruding from the molding material.
Claims8
A method of encapsulating a quad flat non-leaded package, comprising:
- providing a lower mold;
- disposing a resilient film that is a non-adhesive tape on the lower mold;
- disposing a lead frame comprising at least one package unit on the resilient film that has been disposed on the lower mold, wherein the package unit comprises a chip pedestal and a plurality of pins spatially disposed around the chip pedestal;
- providing an upper mold corresponding to the lower mold on the lead frame, forming a die;
- pressing the upper mold, forming protruding portions from the resilient film between the chip pedestal and the pins;
- placing a molding material in the die, encapsulating the chip pedestal and the pins;
- and
- removing the resilient film, forming a quad flat non-leaded package where the lead frame protrudes from surfaces of the molding material.
Dependencies are inferred from the claim text.