Process for producing a thin film with MEMS probe circuits
OwnerWen-Chang Donginventor
Life of this patent
Estimating the term…
Abstract
A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with electric circuits, probes and circuit contacts on the separable interface; forming a raised probe supported-spacer on the probe circuit thin film; separating the probe circuit thin film from the process substrate; and processing a subsequent microstructure working to obtain a thin film with MEMS probe circuits which use the raised probe supported-spacer to form a buffer to prevent the probes from being exposed to much pressure.
Claims7
A process for producing a thin film with MEMS probe circuits comprising steps of:
- (a) providing a flatted process substrate;
- (b) processing a separable interface to be used in subsequent step (e) on the process substrate provided in step (a);
- (c) forming a probe circuit thin film stacked on a surface of the separable interface processed in step (b) to have the probe circuit thin film be pre-fabricated with various electrical circuits, and plural probes and circuit contacts;
- (d) forming a probe supported-spacer raised on the probe circuit thin film having processed in the step (c);
- (e) separating the probe circuit thin film from the process substrate by destroying the separable interface between the process substrate and the probe circuit thin film;
- and
- (f) processing subsequent microstructure's working to the probe circuit thin film to obtain a thin film with MEMS probe circuits.
Dependencies are inferred from the claim text.