Composition which forms an electrically conductive resist layer and a method for patterning a photoresist using the resist layer
AssigneeInfineon Technologies AG
InventorsRafael Abargues, Klaus Elian
Life of this patent
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Abstract
A composition is specified which forms an electrically conductive resist layer and comprises a resin that can be crosslinked to form a base polymer, an organic compound that can be crosslinked to form an electrically conductive substance, a crosslinking agent having an oxidative or reductive action, and at least one solvent. An electrically conductive resist layer of this type may be used for example for dissipating electrical charges when patterning a photoresist by means of electrically charged particles.
Claims18
A method for manufacturing a lithography mask, the method comprising:
- patterning a first electrically conducting material layer disposed over a substrate,
- applying a composition over the patterned first electrically conducting material layer, the composition comprising the following components:
- a resin that can be crosslinked to form a base polymer by thermal treatment, which is not patternable by electrically charged particles;
- an organic compound, initially nonconductive, that can be crosslinked to form a second electrically conductive substance by reaction with a crosslinking agent;
- a crosslinking agent having an oxidative or reductive effect;
- and
- at least one solvent;
- crosslinking the composition thereby producing a electrically conductive resist layer;
- forming a photoresist layer that can be patterned by means of electrically charged particles, the photoresist layer being formed on the electrically conductive resist layer;
- and
- producing structures in the photoresist layer by means of electrically charged particles with electrical charge being dissipated via the resist layer, wherein no structures are formed in the electrically conductive resist layer while producing the structures in the photoresist layer.
A method for patterning a photoresist layer, the method comprising:
- applying a composition to a substrate, the composition comprising:
- a resin that can be crosslinked to form a base polymer, which is not patternable by electrically charged particles and which is insoluble in aqueous developers;
- an organic compound that can be crosslinked to form an electrically conductive substance;
- a crosslinking agent having an oxidative or reductive action;
- and
- at least one solvent;
- crosslinking the composition thereby producing an electrically conductive resist layer, which is not patternable by electrically charged particles and which is insoluble in aqueous developers;
- forming a photoresist layer that can be patterned by means of electrically charged particles, the photoresist layer being formed on the electrically conductive resist layer;
- and
- producing structures in the photoresist layer by means of electrically charged particles with electrical charge being dissipated via the resist layer, wherein no structures are formed in the electrically conductive resist layer while producing the structures in the photoresist layer developing the produced structures in the photoresist layer using an aqueous developer, wherein the electrically conductive resist layer is not dissolved by the aqueous developer.
Dependencies are inferred from the claim text.