Back to results
US 7,351,131 B2Granted
Method for manufacturing semiconductor device and polishing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKenro Nakamura, Naoto Miyashita, Takashi Yoda, Katsuya Okumura
Life of this patent
Estimating the term…
Abstract
In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid on a polishing target surface of the periphery.
Claims7
A polishing apparatus, comprising:
- a polishing member having a polishing face configured to contact at least a periphery of a substrate, the periphery including a bevel portion between a top surface plane and a bottom surface plane of the substrate;
- an elastic member including end portions and being configured to press the polishing member around the periphery of the substrate at an angle less than 90 degrees with respect to the top and bottom surface planes of the substrate;
- and
- a supporting member including supporting portions for supporting the end portions of the elastic member and a recess formed between the supporting portions, the recess being configured for receiving the periphery of the substrate with the polishing member and the elastic member being inserted between the bevel portion of the substrate and an inner wall of the recess and with a space being defined between a back surface of the elastic member opposing with another surface contacting the polishing member and the inner wall of the recess,
- wherein the elastic member is configured to generate tension to press the polishing member when the elastic member is held into the recess of the supporting member.
2 more elements
Dependencies are inferred from the claim text.