Structure of circuit board
AssigneeLotes Co., Ltd
InventorTed Ju
Life of this patent
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Abstract
An improved structure of circuit board, according to the present invention, involves sealing a conductive passageway on a circuit board by use of a spacer disposed in a solder paste. A welding pad is disposed on the conductive passageway so that an electrical terminal is capable of being soldered into the conductive passageway directly. The improved structure of circuit board is capable of stopping the solder paste from entering into the conductive passageway, thus shortening the electrical wiring pathway between the electrical terminal and the circuit board effectively, so as to improve the electrical conductivity between the electrical terminal and the printed circuit board.
Claims10
An improved circuit board structure for connecting with an electrical connector, wherein said circuit board structure thereon provides at least one welding pad where each of the conductive terminal of the electrical connector is capable of being soldered by use of a solder paste, the welding pad thereon has at least one conductive passageway, said circuit board structure thereon also provides at least one spacer to seal the conductive passageway and to stop the solder paste from entering into the conductive passageway during the soldering of the electrical connector, and the spacer is a solder ball.
Dependencies are inferred from the claim text.