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US 7,350,685 B2Granted
Method of mounting electronic component
AssigneeFujitsu Limited
InventorsTakayoshi Matsumura, Hidehiko Kira, Kenji Kobae, Norio Kainuma
Life of this patent
Estimating the term…
Abstract
The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.
Claims7
A method of mounting an electronic component on a circuit board comprising the step of:
- applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes, and
- pressing portions of the circuit board directly by a jig while applying the ultrasonic vibrations to the electronic component, the pressing portions corresponding to peaks of amplitude of vibrations transmitted to the circuit board.
Dependencies are inferred from the claim text.