Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHideki Yabe, Yuichi Sakai, Yoshitatsu Kawama, Munehito Kumagai, Yasuyuki Nakaoka
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Abstract
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
Claims14
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed,
- characterized in that said sensor chip breaking strength inspection apparatus comprises:
- a stage on which said semiconductor wafer is mounted;
- and
- a nozzle that emits a medium onto said sensor chips at a pressure equivalent to a standard breaking strength of said sensor chips.
A sensor chip breaking strength inspection method characterized in that a sensor chip breaking strength inspection is performed while cleaning during or after dicing of a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed, said sensor chip breaking strength inspection being performed by emitting a medium at said sensor chips at a pressure equivalent to a standard breaking strength of said sensor chips.
Dependencies are inferred from the claim text.