Meniscus proximity system for cleaning semiconductor substrate surfaces

An apparatus for fluid processing a semiconductor wafer, the apparatus comprising:

• a top proximity head defined as an elongated shape that extends at least a diameter of the semiconductor wafer, the top proximity head is defined for placement on a top side of the semiconductor wafer;
• a bottom proximity head defined as an elongated shape that extends at least the diameter of the semiconductor wafer, the bottom proximity head defined for placement on a bottom side of the semiconductor wafer, the bottom side is opposite the top side;
• each of the top proximity head and the bottom proximity head having conduits formed therein for delivering and removing fluids so that a meniscus is capable of being contained between each of the top proximity head and a surface of the top side of the semiconductor wafer and the bottom proximity head and a surface of the bottom side of the semiconductor wafer, the ton proximity head and the bottom proximity head having head surfaces that include substantially flat surface regions and discrete holes for defining the conduits, the discrete holes extending through the head surfaces of the top proximity head and the bottom proximity head.

The apparatus for fluid processing a semiconductor wafer 7, further comprising:

• source inlets coupled to selected ones of the conduits of the top proximity head and the bottom proximity head;
• and
• source outlets coupled to selected ones of the conduits of the top proximity head and the bottom proximity head.

The apparatus for fluid processing a semiconductor wafer 8, further comprising:

• a fluid source coupled to the source inlets;
• and
• a fluid output coupled to the source outlets for receiving fluids removed from the surface of the top side and the bottom side.

The apparatus for fluid processing a semiconductor wafer 7, further comprising:

• a carrier assembly coupled to the top proximity head and the bottom proximity head, the carrier assembly defining positional adjustment of the top and bottom proximity heads relative to the surface of the top side and the bottom side, respectively.

The apparatus for fluid processing a semiconductor wafer 7, further comprising:

• controllers for controlling flows to and from each of the top and bottom heads.

The apparatus for fluid processing a semiconductor wafer 11, wherein each of the controllers is an independent system.

The apparatus for fluid processing a semiconductor wafer 7, wherein the meniscus is defined from at least one or more of deionized water (DIW), a cleaning fluid, and gases.

The apparatus for fluid processing a semiconductor wafer 13, wherein the gases are one of isopropyl alcohol (IPA) vapor, nitrogen, organic compounds, hexanol, ethyl glycol, and compounds miscible with water.