Edge wheel dry manifold

A processing system for processing a semiconductor wafer, the processing system comprising:

• a plurality of edge wheels, each of the edge wheels having a groove defined by sidewalls of the edge wheel, the edge wheels being positioned to rotationally support the semiconductor wafer by the grooves of the edge wheels;
• and
• a manifold disposed adjacent to each of the edge wheels, each manifold having a proximity end positioned within the groove of the edge wheel, the proximity end conforming to the shape of the groove of the edge wheels, and the proximity end being configured to maintain an operational clearance in a range of 0.002 inch to 0.06 inch between the proximity end and the edge wheel,
• wherein the proximity end removes fluids from the groove of the edge wheel using a vacuum port.

A method for holding an edge of a semiconductor wafer, the method comprising:

• receiving the edge of the semiconductor wafer by at least three edge wheels each having a groove;
• and
• vacuuming fluids from each of the grooves of the edge wheels, while the semiconductor wafer is held by the grooves of the edge wheels,
• wherein the vacuuming of fluids from each of the grooves includes,
• providing an edge wheel drying manifold that includes a proximity end conforming to the shape of the grooves of the edge wheels;
• positioning the proximity end of the edge wheel drying manifold adjacent to and partially within the grooves of each of the edge wheels, the positioning including maintaining an operational clearance in a range of 0.002 inch to 0.06 inch between the proximity end and at least one edge wheel;
• providing vacuum to the edge wheel drying manifold, the vacuum removing fluids from the groove of the wheels;
• and
• rotating the wheels, the rotating of the wheels imparting rotation to the semiconductor wafer, wherein the vacuum provided to the edge wheel drying manifold removes fluid from the grooves of each of the edge wheels.

A spin, rinse, and dry (SRD) module of a semiconductor wafer processing apparatus, the SRD module comprising:

• three edge wheels each having a groove, the groove being defined by sidewalls of the edge wheel, the edge wheels being positioned for receiving a semiconductor wafer;
• a manifold body associated with each of the edge wheels, the manifold body including a proximity end configured to conform to the shape of the edge wheels, the proximity end being positioned to maintain an operational clearance in a range of 0.002 inch to 0.06 inch between the proximity end and the edge wheels;
• and
• a vacuum port defined in the proximity end of the manifold body,
• wherein the manifold body is positioned adjacent to the edge wheel, such that the vacuum port is positioned for removing fluids from the groove.

A method for drying a semiconductor wafer, the method comprising:

• positioning the semiconductor wafer in a groove formed in a peripheral edge of an edge wheel, the groove thereby receiving a peripheral edge of the semiconductor wafer;
• providing an edge wheel manifold adjacent to the edge wheel, the edge wheel manifold having a proximity end configured to remove fluid from the groove using suction, the proximity end being configured to conform to the shape of the groove, and the proximity end being positioned to maintain an operational clearance in a range of 0.002 inch to 0.06 inch between the proximity end and the groove;
• rotating the semiconductor wafer;
• and
• vacuuming fluid from the groove using the proximity end of the edge wheel manifold.