Back to results
US 7,350,299 B2Granted
Method for reducing socket warpage
AssigneeIntel Corporation
InventorsTim A. Renfro, Brian C. Kluge, Jiteender P. Manik
Life of this patent
Estimating the term…
Abstract
A method and a structure for reducing socket warpage in an embodiment by forming at least one groove in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove.
Claims6
A method comprising:
- forming at least one groove in a socket housing contiguous to and in the same plane as a surface mount region for an electrical device;
- and
- securing a rigid bar within the at least one groove to thereby ensure that the surface mount region is flat and remains flat, wherein no portion of the rigid bar extends outside the at least one groove, and
- retaining the rigid bar within the at least one groove using a plurality of clips.
1 more element
A method comprising:
- forming a U-shaped groove in a socket housing contiguous to three sides of a surface mount region for an electrical device, and
- securing a U-shaped rigid warpage reinforcement bar in the three sides in a mating relationship in the U-shaped groove to provide a surface mount region for an electrical device within the U-shape of the U-shaped bar in the U-shaped groove to thereby ensure that the surface mount region is flat and remains flat, and
- retaining the U-shaped rigid warpage reinforcement bar in the U-shaped groove using a plurality of clips.
Dependencies are inferred from the claim text.