Method for fabricating circuit board with conductive structure

A method for fabricating a circuit board with a conductive structure, comprising the steps of:

• providing a circuit board with first and second surfaces, the first surface of the circuit board having a plurality of first and second electrically connecting pads, and the second surface having a plurality of third electrically connecting pads, and, moreover, forming first and second insulating protective layers respectively on the first and second surfaces, and forming a plurality of openings to expose the first, second, and third electrically connecting pads;
• forming a first conductive layer on the surfaces of the first insulating protective layer and the openings, electrically connected to the first and second electrically connecting pads on the first surface of the circuit board;
• forming a second conductive layer on the surfaces of the second insulating protective layer and the openings, electrically connected to the third electrically connecting pads of the circuit board;
• forming first and second resist layers on the surfaces of the first and second conductive layers respectively, and forming a plurality of openings in the first and second resist layers to expose the first and second conductive layers on the first and third electrically connecting pads;
• forming first electrically connecting structures by electroplating on the first and second conductive layers on the first and third electrically connecting pads;
• removing the first and second resist layers, and removing the first and second conductive layers covered by the first and second resist layers;
• and
• forming second electrically connecting structures by stencil printing on the surfaces of the second electrically connecting pads in the openings of the first insulating layer.

A method for fabricating a circuit board with a conductive structure, comprising the steps of:

• providing a circuit board with first and second surfaces, the first surface of the circuit board having a plurality of first and second electrically connecting pads, and the second surface having a plurality of third electrically connecting pads, and, moreover, forming first and second insulating protective layers respectively on the first and second surfaces, and forming a plurality of openings to expose the first, second, and third electrically connecting pads;
• forming a first conductive layer on the surfaces of the first insulating protective layer and the openings, electrically connected to the first and second electrically connecting pads on the first surfaces of the circuit board;
• forming a second conductive layer on the surfaces of the second insulating protective layer and the openings, electrically connected to the third electrically connecting pads on the circuit board;
• forming first and second resist layers on the surfaces of the first and second conductive layers respectively, and forming a plurality of openings in the first and second resist layers to expose the first and second conductive layers on the first, second, and third electrically connecting pads;
• forming first electrically connecting structures by electroplating on the first and second conductive layers on the first, second, and third electrically connecting pads in the openings of the first and second resist layers;
• removing the first and second resist layers, and removing the first and second conductive layers covered by the first and second resist layers;
• and
• forming second electrically connecting structures by stencil printing on the first electrically connecting structures of the first conductive layer on surfaces of the second electrically connecting pads in the openings of the first insulating layer.