Method of fabricating multi-layered printed circuit board for optical waveguides

A method of fabricating a multi-layered printed circuit board for optical waveguides, comprising:

• pre-routing a first portion of a first prepreg meeting an optical waveguide to remove said first portion;
• pre-routing a second portion of a second prepreg meeting the first prepreg to remove said second portion so as to prevent the first prepreg from blocking an optical signal entrance of the optical waveguide, said second prepreg being partially cut;
• arranging the optical waveguide, the first prepreg, and the second prepreg on a copper clad laminate (CCL) such that the optical waveguide is in the removed portion of the first prepreg and the second prepreg is on the first prepreg;
• and
• combining the optical waveguide, the first prepreg, and the second prepreg with each other into a single structure.

A method of fabricating a multi-layered printed circuit board for optical waveguides, comprising:

• pre-routing a first portion of a single-sided copper clad laminate (SSCCL) to remove said first portion;
• pre-routing a second portion of a prepreg meeting an optical waveguide to remove said second portion so as to prevent the first SSCCL from blocking an optical signal entrance of the optical waveguide;
• arranging the optical waveguide, the prepreg, and the SSCCL on a copper clad laminate (CCL) such that the optical waveguide is in the removed portion of the prepreg and the SSCCL is on the prepreg;
• and
• combining the optical waveguide, the prepreg, and the SSCCL with each other into a single structure.

A method of fabricating a multi-layered printed circuit board for optical waveguides, comprising:

• coating a thermally curable resin on a first copper clad laminate (CCL);
• cutting a portion of the thermally curable resin to form an optical signal entrance corresponding to a position which is to be met to an optical waveguide;
• pre-routing a portion of a prepreg meeting the optical waveguide to remove said portion of the prepreg;
• arranging the optical waveguide, the thermally curable resin, and the prepreg on a second CCL such that the optical waveguide is in the removed portion of the prepreg and the thermally curable resin is on the prepreg;
• and
• combining the optical waveguide, the thermally curable resin, and the prepreg with each other into a single structure.

A method of fabricating a multi-layered printed circuit board for optical waveguides, comprising:

• etching a portion of a heat spreader to form an optical signal entrance;
• layering an optical waveguide on a copper clad laminate (CCL);
• pre-routing a portion of a prepreg meeting the optical waveguide to remove said portion of the prepreg so as to prevent the head spreader from blocking an optical signal entrance of the optical waveguide;
• arranging the optical waveguide, the prepreg, and the heat spreader such that the optical waveguide is in the removed portion of the prepreg and the heat spreader is on the prepreg;
• and
• combining the optical waveguide, the prepreg, and the heat spreader with each other into a single structure.

A method of fabricating a multi-layered printed circuit board for optical waveguides, comprising:

• etching a portion of an unclad to form an optical signal entrance;
• layering an optical waveguide on a copper clad laminate (CCL);
• pre-routing a portion of a prepreg meeting the optical waveguide to remove said portion of the prepreg so as to prevent the unclad from blocking an optical signal entrance of the optical waveguide;
• arranging the optical waveguide, the prepreg, and the unclad such that the optical waveguide is in the removed portion of the prepreg and the unclad is on the prepreg;
• and
• combining the optical waveguide, the prepreg, and the unclad with each other into a single structure.