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AssigneeSumitomo Bakelite Co., Ltd.
InventorsHideo Ito, Tamaya Ubukata, Yoshitaka Hirose
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The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by encapsulating under pressurizing with the compression plunger. Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-encapsulated type semiconductor packages that produce less flowing of the wires.
A resin-encapsulated type semiconductor package-producing method comprising feeding a powdery or granular resin composition into a weighing pot and weighing the resin composition, feeding the resin composition from the weighing pot to an agitating pot having a heater, agitating and melting the resin composition in the agitating pot, taking out the agitated and melted resin composition and forming it in the form of a package under pressure, fitting a lead frame or a tape substrate on which semiconductor chips or electronic parts are attached to a cavity of an upper molding die unit of a molding die having a heater, fitting the preshaped resin composition formed in the package shape to a compression plunger inside a cavity of a lower molding unit, after clamping the molding die, obtaining an integrally molded body by encapsulating the semiconductor chips or electronic parts and the lead frame or tape substrate through pressing the resin composition with the compression plunger and molding and curing the resin composition, and taking out the integrally molded semiconductor package from the molding die.
A resin composition-encapsulated type semiconductor package-producing apparatus comprises a weighing unit for feeding a powdery or granular resin composition into a weighing pot and weighing it, a resin feeder for feeding the resin composition from the weighing pot into an agitating pot having a heater, an agitating/melting unit for agitating and melting the resin composition in the agitating pot, a forming unit for taking out the agitated and melted resin composition and forming it in the form of a package under pressure, a device for attaching an object to be encapsulated, said device being adapted for attaching a lead frame or a tape substrate on which semiconductor chips or electronic parts are attached to a cavity of an upper molding unit of a molding die having a heater, an encapsulating resin-fitting device for fitting the preshaped resin composition formed in the package shape to a compression plunger inside a cavity of a lower molding unit, an encapsulating device for obtaining an integrally molded body, after clamping the molding die, by encapsulating the semiconductor chips or electronic parts and the lead frame or tape substrate through pressing the resin composition with the compression plunger and molding and curing the resin composition, and a takeout device for taking out the resulting semiconductor package from the molding die.
Dependencies are inferred from the claim text.