Method and arrangement for attaching labels to semiconductor modules
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Soo Lee, Myung-Jong Eom, Byung-Man Kim, Dong-Chun Lee
Life of this patent
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Abstract
A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.
Claims36
An arrangement for attaching labels on semiconductor modules mounted on a double-sided substrate, comprising:
- a first label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate;
- a first turner configured to turn over the double-sided substrate on which the labeled semiconductor modules are mounted;
- a controller configured to control the first label attaching unit and first turner;
- and
- a second turner under control of the controller and configured to turn over the double-sided substrate, wherein the first turner turns over the double-sided substrate to expose the second surface thereof, and the second turner turns over the double-sided substrate to expose the first surface thereof, and the first label attaching unit attaches labels to the semiconductor modules mounted on the first and second surfaces.
A method for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate, comprising:
- (a) attaching labels to the plurality of semiconductor modules mounted on a first surface of the double-sided substrate;
- (b) turning over the double-sided substrate on which the labeled semiconductor modules are mounted to expose a second surface using a first turner and a second turner configured to turn over the double-sided substrate to expose the first surface thereof;
- and
- (c) attaching labels to the plurality of semiconductor modules mounted on the second surface.
A method for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate, comprising:
- (a) attaching labels to a plurality of semiconductor modules mounted on a first surface of the double-sided substrate;
- (b) turning over the double-sided substrate on which the labeled semiconductor modules are mounted to expose a second surface of the double-sided substrate using a first turner and a second turner configured to turn over the double-sided substrate to expose the first surface thereof;
- (c) attaching labels to a plurality of semiconductor modules mounted on the second surface;
- and
- (d) transferring the double-sided substrate with labeled semiconductor devices on the first and second surfaces in preparation for an unloading operation.
A method for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate, comprising:
- (a) attaching labels to the, plurality of semiconductor modules mounted on a first surface of the double-sided substrate;
- (b) transferring the double-sided substrate with the labeled semiconductor modules on the first surface in preparation for a turning operation;
- (c) turning over the double-sided substrate on which the labeled semiconductor modules are mounted to expose the second surface using a first turner and a second turner configured to turn over the double-sided substrate to expose the first surface thereof;
- (d) transferring the double-sided substrate with the exposed second surface in preparation for a label attaching operation;
- (e) attaching labels to a plurality of semiconductor modules mounted on the second surface;
- (f) transferring the double-sided substrate with the labeled semiconductor modules on the first surface and second surface in preparation for a turning operation;
- (g) turning over the double-sided substrate with labeled semiconductor modules on both the first and second surfaces so as to return the double-sided substrate to its original orientation prior to (a);
- and
- (h) unloading the double-sided substrate.
An arrangement for attaching labels on semiconductor modules mounted on a double-sided substrate, comprising:
- at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate;
- and
- first and second turners configured to turn over the double-sided substrate on which the labeled semiconductor modules are mounted to expose one of the first surface and second surface to the label attaching unit, wherein
- the first turner turns over the double-sided substrate to expose the second surface thereof, and the second turner turns over the double-sided substrate to expose the first surface thereof, and the at least one label attaching unit attaches labels to the semiconductor modules mounted on the first and second surfaces.
A method for attaching labels to a plurality of semiconductor modules arranged on one or more double-sided substrates, comprising:
- (a) attaching labels to the plurality of semiconductor modules mounted on a first surface of a first double-sided substrate;
- (b) transferring the first double-sided substrate in preparation for a turning operation;
- (c) turning over the double-sided substrate on which the labeled semiconductor modules are mounted to expose the second surface using a first turner and a second turner configured to turn over the double-sided substrate to expose the first surface thereof;
- (d) transferring the first double-sided substrate in preparation for a label attaching operation while simultaneously loading a second double-sided substrate in preparation for (a);
- and
- (e) attaching labels to a plurality of semiconductor modules mounted on the second surface of the first double-sided substrate while simultaneously attaching labels to a plurality of semiconductor modules mounted on a first surface of the second double-sided substrate loaded in (d).
Dependencies are inferred from the claim text.