Test socket-lid assembly

Abstract

A test socket-lid assembly for testing electronic devices such as IC chips consists of a socket sub-assembly and a lid-sub-assembly, which is separated from the socket sub-assembly. In the lid sub-assembly, the lid is pivotally connected to the frame and supports a spring-loaded pusher that can slide in a vertical direction relative to the lid and can perform rocking movements relative to the lid. The assembly is distinguished from existing devices of this type in that the IC chip is supported and clamped in the lid sub-assembly and in that the entire lid sub-assembly together with the clamped and spring-loaded pusher is attached to the socket by guiding the lid sub-assembly in a transverse direction along the socket guide to the position wherein the spring plungers are locked into their respective openings on the surface of the socket. In one embodiment the pusher is a single part that has three degrees of freedom relative to the IC chip; in another embodiment, the pusher is of a composite structure and has five degrees of freedom.

Dependencies are inferred from the claim text.