Integration of fault detection with run-to-run control

A method for processing wafers, said method comprising:

• 1) processing said wafers according to a recipe, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• 2) measuring wafer properties;
• 3) detecting conditions indicative of a fault condition using a fault detection system;
• 4) modifying said at least one setpoint of said recipe according to said measured wafer properties to maintain said target wafer properties in the absence of a fault condition, and not modifying said at least one setpoint of said recipe according to said measured wafer properties in the presence of a fault condition;
• and
• 5) incorporating said modified setpoint of said recipe as a parameter in said fault detection system.

A system for processing wafers in a manufacturing execution system, said system comprising

• a run-to-run controller for controlling a tool according to a recipe received from said manufacturing execution system, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• a sensor for measuring processing attributes including wafer properties;
• a fault detector for monitoring said wafer properties to detect conditions indicative of a fault condition and forwarding said conditions to said run-to-run controller;
• wherein said at least one setpoint of said recipe is modified according to said processing attributes to maintain said target wafer properties, except when a fault condition is detected by said fault detector in which case the at least one setpoint is not modified according to said processing attributes;
• and
• wherein said modified setpoint of said recipe is incorporated as a parameter in said fault detector.

A system for processing wafers in a manufacturing execution system using a run-to-run controller with a fault detection system, said system comprising:

• means for receiving, into said run-to-run controller, a recipe for controlling a tool, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• means for monitoring processing of said wafers by measuring processing attributes including wafer properties and fault conditions identified by said fault detection system;
• means for forwarding said processing attributes to said run-to-run controller;
• and
• means for modifying said at least one setpoint of said recipe at said run-to-run controller according to said processing attributes to maintain said target wafer properties, except when a fault condition is detected by said fault detection system in which case the at least one setpoint of said recipe is not modified according to said processing attributes, said modified setpoint of said recipe being incorporated as a parameter in said fault detection system.

A system for processing wafers, said system comprising:

• means for processing said wafers according to a recipe, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• means for measuring wafer properties;
• means for detecting conditions indicative of a fault condition;
• and
• means for modifying said at least one setpoint of said recipe according to said measured wafer properties to maintain said target wafer properties in the absence of a fault condition, and not modifying said at least one setpoint of said recipe according to said measured wafer properties in the presence of a fault condition, wherein said modified setpoint of said recipe is incorporated as a parameter in said means for detecting conditions indicative of a fault condition.

A computer program embodied on a computer-readable medium for processing wafers in a manufacturing execution system using a run-to-run controller with a fault detection system, said computer readable medium comprising:

• computer readable instructions for receiving, into said run-to-run controller, a recipe for controlling a tool, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• computer readable instructions for monitoring processing of said wafers by measuring processing attributes including wafer properties and fault conditions identified by said fault detection system;
• computer readable instructions for forwarding said processing attributes to said run-to-run controller;
• and
• computer readable instructions for modifying said at least one setpoint of said recipe at said run-to-run controller according to said measured processing attributes to maintain said target wafer properties, except when a fault condition is detected by said fault detection system in which case the at least one setpoint of said recipe is not modified according to said measured processing attributes, wherein said modified setpoint is incorporated as a parameter in said fault detection system.

A computer program embodied on a computer-readable medium for processing wafers, said computer-readable medium comprising:

• computer readable instructions for processing said wafers according to a recipe, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• computer readable instructions for measuring wafer properties;
• computer readable instructions for detecting conditions indicative of a fault condition;
• and
• computer readable instructions for modifying said at least one setpoint of said recipe according to said measured wafer properties to maintain said target wafer properties in the absence of a fault condition, and not modifying said at least one setpoint of said recipe according to said measured wafer properties in the presence of a fault condition, wherein said modified setpoint is incorporated as a parameter in a fault detection system.

A method for processing wafers in a manufacturing execution system using a run-to-run controller with a fault detection system, said method comprising:

• 1) receiving, into said run-to-run controller, a recipe for controlling a tool, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• 2) monitoring processing of said wafers by measuring processing attributes including wafer properties and fault conditions identified by said fault detection system;
• 3) forwarding said processing attributes to said run-to-run controller;
• 4) modifying said at least one setpoint of said recipe at said run-to-run controller according to said measured processing attributes to maintain said target wafer properties when no fault condition is detected by said fault detection system;
• and
• 5) refraining from modifying said at least one setpoint of said recipe at said run-to-run controller according to said measured processing attributes when a fault condition not requiring termination of said processing is detected by said fault detection system.

A system for processing wafers in a manufacturing execution system, said system comprising

• a run-to-run controller for controlling a tool according to a recipe received from said manufacturing execution system, wherein said recipe includes at least one setpoint for obtaining one or more target wafer properties;
• a sensor for measuring processing attributes including wafer properties;
• a fault detector for monitoring said wafer properties to detect conditions indicative of a fault condition and forwarding said conditions to said run-to-run controller;
• and
• wherein said at least one setpoint of said recipe is modified according to said processing attributes to maintain said target wafer properties when no fault condition is detected by said fault detector, and wherein said at least one setpoint of said recipe is refrained from being modified according to said measured processing attributes when a fault condition not requiring termination of said processing is detected by said fault detector.