Arrangement for energy conditioning

An electrical arrangement comprising:

• at least a first and a second plurality of pathways;
• wherein the first plurality includes at least one pair of pathways electrically isolated from each other and arranged in mutual complementary position;
• wherein at least a first number of pathways of said second plurality is arranged electrically isolated from a second number of pathways of said second plurality, and wherein said second plurality includes at least two pathways electrically isolated from said first 120 plurality;
• wherein at least two pathways of said first number of pathways of said second plurality are electrically coupled to one another;
• wherein at least two pathways of said second number of pathways of said second plurality are electrically coupled to one another;
• and
• further comprising a spacing material that at least spaces apart pathways of said circuit arrangement.

A system, comprising:

• an integrated circuit package having at least one integrated circuit;
• a plurality of pathways conductively coupled together;
• a first plurality of shields conductively coupled together;
• a second plurality of shields conductively coupled together and electrically isolated from at least said first plurality;
• and
• wherein each of said shields and said pathways are alternately arranged, and wherein said shields develop at least one low impedance pathway suitable for energy propagation away from said integrated circuit;
• and
• wherein said pathways develop a low inductance pathway suitable for energy propagation within said integrated circuit package, said energy propagation being conditioned 190 by at least said plurality of shields.

A device comprising:

• a first electrically conductive shield layer that resides in a first plane;
• a third electrically conductive shield layer that resides in a third plane;
• a fifth electrically conductive shield layer that resides in a fifth plane;
• said third plane is between said first plane and said fifth plane;
• a first electrically conductive electrode layer that resides in a second plane, and said second plane is between said first plane and said third plane;
• a third electrically conductive electrode layer that resides in a fourth plane, said fourth plane is between said third plane and said fifth plane;
• said device electrically connects said first electrically conductive shield layer, said third electrically conductive shield layer, and said fifth electrically conductive shield layer to one another;
• said first electrically conductive shield layer, said third electrically conductive shield layer, and said fifth electrically conductive shield layer are stacked, said first electrically conductive electrode layer is substantially between said first electrically conductive shield layer and said third electrically conductive shield layer, and said third electrically conductive electrode layer is substantially between said third electrically conductive shield layer and said fifth electrically conductive shield layer;
• a second electrically conductive shield layer;
• a fourth electrically conductive shield layer;
• a sixth electrically conductive shield layer;
• a second electrically conductive electrode layer;
• a fourth electrically conductive electrode layer;
• said device electrically connects said second electrically conductive shield layer, said fourth electrically conductive shield layer, and said sixth electrically conductive shield layer to one another;
• said second electrically conductive shield layer, said fourth electrically conductive shield layer, and said sixth electrically conductive shield layer are stacked, said second electrically conductive electrode layer is substantially between said second electrically conductive shield layer said fourth electrically conductive shield layer, and said fourth electrically conductive electrode layer is substantially between said fourth electrically conductive shield layer and said sixth electrically conductive shield layer.