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US 7,329,114 B2Granted
Isothermal imprint embossing system
AssigneeKomag, Inc.
InventorsBruce M. Harper, Toshiyuki Max Saito, Christopher H. Bajorek
Life of this patent
Estimating the term…
Abstract
Isothermal imprint embossing system. In one embodiment, the system includes a heater to pre-heat a disk substrate to an embossing temperature, a die assembly with an embossing foil to imprint the embossable film disposed on the disk substrate, and a heat tunnel disposed between the heater and the die assembly to maintain the embossing temperature.
Claims16
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature;
- and
- a transporting device for the substrate, wherein the transporting device comprises a vacuum chuck coupled to a robotic arm.
2 more elements
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature;
- and
- a transporting device for the substrate, wherein the transporting device comprises a servo slide.
2 more elements
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- and
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature, wherein the die assembly comprises:
- an elongated shaft with a tapered mandrel end portion to receive the substrate having a hole defined by an inner dimension edge of the substrate;
- a ball bushing disposed around the elongated shaft;
- and
- a ring portion disposed between the ball bushing and the embossing foil, wherein the ball bushing has a thermal expansion to enable the ball bushing to expand and secure the ring portion to the embossing foil and to align a centerline of the embossing foil with a centerline of the substrate.
5 more elements
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature;
- and
- a gas actuation bladder coupled to the die assembly.
2 more elements
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature;
- and
- a vision device to inspect an imprint pattern on the substrate.
2 more elements
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- and
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature, wherein the die assembly is used to imprint the embossable film for production of an optical recording disk.
1 more element
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- and
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature, wherein the die assembly is used to imprint the embossable film for production of a semiconductor device.
1 more element
An assembly, comprising:
- a heater to pre-heat an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- a die assembly having an embossing foil to imprint the embossable film;
- and
- a heat tunnel disposed between the heater and the die assembly to maintain the approximate embossing temperature, wherein the substrate comprises a disk.
1 more element
An assembly, comprising:
- means for pre-heating an entire substrate and an entire embossable film, disposed above the substrate, to an approximate embossing temperature;
- and
- means for transporting the substrate to an imprinting die assembly, having an embossing foil, while maintaining the approximate embossing temperature.
Dependencies are inferred from the claim text.