Method of manufacturing printed wiring boards
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKiyohide Tatsumi, Toshihiro Nishii, Shinji Nakamura
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Abstract
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
Claims24
A method of manufacturing printed wiring boards, the method including the step of applying heat and press (heat and press stage) to both a layered structure, which comprises a board member and a metal plate, and a cushion which is disposed between at least one hot-plate of a hot-presser applying heat and press and the layered structure, wherein
- the cushion is a reusable sheet-like layered body which includes an inner layer, a blocking layer, and a functional surface layer,
- the functional surface layer is formed on at least one of the faces of said sheet-like layered body, and
- the blocking layer exists on an interface between the functional surface layer and the inner layer,
- wherein the blocking layer is thermosetting resin.
Dependencies are inferred from the claim text.