Wired circuit board holding sheet and production method thereof
AssigneeNitto Denko Corporation
InventorsNaotaka Higuchi, Kenkichi Yagura
Life of this patent
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AssigneeNitto Denko Corporation
InventorsNaotaka Higuchi, Kenkichi Yagura
Estimating the term…
A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. In the wired circuit board holding sheet 1 comprising a sheet 2 holding therein a plurality of separable wired circuit boards 3, the respective wired circuit boards 3 are held in the sheet 2 via joints 4 to be cut, and cutting notches 6 to facilitate cutting of the joints 4 and marking notches 7 to indicate that the cutting notches 6 have a predetermined depth to cut the joints 4 are formed simultaneously in both front and back surfaces of the joints 4 by using punches having combination of a main punch portion 13 and a sub-punch portion 14.
A wired circuit board assembly comprising:
Dependencies are inferred from the claim text.