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US 7,317,256 B2Granted
Electronic packaging including die with through silicon via
AssigneeIntel Corporation
InventorsChristina K. Williams, Rainer E. Thomas
Life of this patent
Estimating the term…
Abstract
An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.
Claims16
An electronic package, comprising:
- a mount having a lead;
- a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead;
- a silicon spacer landed on the first through-silicon via;
- a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer;
- and
- a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another.
3 more elements
A system comprising:
- an electronic package, comprising:
- a mount having a lead;
- a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead:
- a silicon spacer landed on the first through-silicon via;
- a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer;
- and
- a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another;
- a bus coupled to the electronic package;
- and
- a mass storage coupled to the bus.
7 more elements
Dependencies are inferred from the claim text.