Spin-on protective coatings for wet-etch processing of microelectronic substrates
AssigneeBrewer Science Inc.
InventorsChenghong Li, Kimberly A. Ruben, Tony D. Flaim
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AssigneeBrewer Science Inc.
InventorsChenghong Li, Kimberly A. Ruben, Tony D. Flaim
Estimating the term…
New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.
A microelectronic structure comprising:
A microelectronic structure comprising:
A microelectronic structure comprising:
Dependencies are inferred from the claim text.