US 7,314,599 B2 · Paek embossing and adhesion for microfluidic devices

Abstract

A fabrication and adhesion method for a polyaryl-ether-ketone (PAEK) device, such as a microfluidic device, is disclosed. At least one glassy uncrystallized PAEK substrate is heated up to near or above the glass transition temperature to allow the substrate to crystallize from the glass state, while embossing the substrate with patterns. Bonding the PAEK substrate to another substrate is accomplished using a solvent-resistant adhesive, such as a polyimide-based adhesive, in combination with an adhesion enhancement treatment. In certain embodiments, the adhesion enhancement treatment is a plasma treatment or a chemical sulfonation treatment.

Claims13

Dependent claims

A method for fabricating a microfluidic device, comprising:

heating a substrate composed of a glassy uncrystallized polyaryl-ether-ketone (PAEK) material from below the glass transition temperature of the PAEK material to at least a temperature sufficient to produce rapid crystallization of the PAEK material;
embossing said PAEK substrate while the temperature of said PAEK substrate is between the glass transition temperature of the PAEK material and the temperature sufficient to produce rapid crystallization of the PAEK material in said heating to form a patterned PAEK crystalline substrate;
and
forming said microfluidic device using said patterned PAEK crystalline substrate and an additional substrate.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/114,801Filed 2 Apr 2002 · continuation in part

Priority

17 Jul 2001

Published

US 2003/0017305 A123 Jan 2003

Granted

1 Jan 2008

Term ends

Not estimatedThe source records don’t support an estimate.

Classification64 codes

B29C 66/82661
Using fluid pressure directly acting on the parts to be joined: by means of vacuum
B01L 3/502707
By integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g.…
B01L 3/502738
By integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g.…
B29C 59/02
Surface shaping of articles, e.g. embossing; Apparatus therefor: by mechanical means, e.g. pressing

Family

Application09/908,231Parent of this continuation-in-part · filed 17 Jul 2001

US 2003/0017305 A1Pre-grant publication · published 23 Jan 2003

US 2003/0017609 A1Published application

US 7,128,876 B2Related patent

US 7,314,599 B2This patent

From the US filing history. Foreign family members aren’t listed.

Paek embossing and adhesion for microfluidic devices

Life of this patent

Paek embossing and adhesion for microfluidic devices

Life of this patent

Abstract

Claims13