US 7,311,516 B2Granted

Die for molding disk substrate and method of manufacturing disk substrate

AssigneeMatsushita Electric Industrial Co., Ltd.

InventorKazuo Inoue

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Abstract

A die for molding a disk substrate capable of forming fine recessed and projected pits and grooves up to the outer periphery of the disk substrate by preventing low heat conductive elements from peeling off and burrs from occurring on the outer periphery thereof. The die includes a first base die, a second base die disposed oppositely to the first base die, a first low heat conductive element fixed to the first base die, a stamper fixed onto the first low heat conductive element, a second low heat conductive element fixed onto the second base die, and a ring-like regulating member fitted to and in slidable contact with either of the first and second low heat conductive elements. The die is characterized in that the end part of the ring-shaped regulating member is positioned within the range of the outer peripheral side face of the low heat conductive element in slidable contact therewith.

Claims5

Dependent claims

A disk-substrate molding die including:

a first base die;
a second base die which is placed to face the first base die;
a first low heat-conductivity member secured to the first base die;
a stamper secured on the first low heat-conductivity member;
a second low heat-conductivity member secured on the second base die;
and
a ring-shaped restriction member which is fit on one of the first low heat-conductivity member and the second low heat-conductivity member and is in slidable contact therewith, wherein:
an end portion of the ring-shaped restriction member is positioned within a region of an outer peripheral side surface of the low heat-conductivity member which is in slidable contact therewith,
the low heat-conductivity member, which is in slidable contact with the ring-shaped restriction member, covers the outer peripheral side surface of the corresponding base die, and
one of the first and second base dies has a slot which receives an extending end portion of the corresponding low heat-conductivity member when the corresponding low heat-conductivity member extends to a position which covers wholly the outer peripheral side surface of the corresponding base die.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/547,552Filed 25 Feb 2004
Priority: JP 2003-0555203 Mar 2003
Published: US 2006/0188600 A124 Aug 2006
Granted: 25 Dec 2007
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

B29D 17/005
Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records ; Producing record…:…
B29C 45/263
Moulds: with mould wall parts provided with fine grooves or impressions, e.g. for record discs
B29C 33/3828
Characterised by the material or the manufacturing process: moulds made of at least two different materials having different thermal conductivities
B29C 2045/2636
Mounting layers between stamper and mould or on the rear surface of the stamper: insulating layers