Method for forming patterned media for a high density data storage device

A method of forming a media for use in a high density data storage device, the method comprising the steps of:

• depositing a conductive layer;
• depositing a recording media over the conductive layer;
• depositing a metal layer over the recording media so that the recording media and the conductive layer are underlying layers;
• depositing a photoresist layer;
• transferring a pattern to the photoresist layer using nano-imprint lithography, the pattern including a plurality of holes;
• etching the metal layer by using an etch process having sufficiently high selectivity to one of the underlying layers such that a plurality of cells is formed without removing the one of the underlying layers from within the cells;
• depositing a dielectric material such that a first portion of the dielectric material is deposited within the cells so that the first portion of the dielectric material isolates the cells across the metal layer and a second portion of the dielectric material is deposited over the metal;
• removing the second portion of the dielectric material disposed over the metal.

A method of forming a media for use in a high density data storage device, the method comprising the steps of:

• depositing a conductive layer;
• depositing a dielectric layer over the conductive layer;
• depositing a photoresist layer;
• transferring a pattern to the photoresist layer by nano-imprint lithography, the pattern defining a plurality of holes;
• etching the dielectric layer by using an etch process having sufficiently high selectivity to the conductive layer such that the plurality of holes is transferred through the dielectric layer to expose the conductive layer without removing the conductive layer, the plurality of holes being tapered so that the plurality of holes narrow toward an interface of the dielectric layer and the conductive layer;
• depositing a recording media such that a first portion of the recording media is deposited within the holes so that the first portion is in electrical communication with the conductive layer and a second portion of the recording media is deposited over a portion of the dielectric layer;
• removing the second portion of the recording media disposed over the dielectric layer;
• depositing a metal layer such that the a first portion of the metal layer is deposited within holes and a second portion of the metal is deposited over a portion of the dielectric layer;
• and
• removing the second portion of the metal layer disposed over the dielectric layer.