Nitride semiconductor device such as transverse power FET for high frequency signal amplification or power control
AssigneeKabushiki Kaisha Toshiba
InventorsWataru Saito, Ichiro Omura
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AssigneeKabushiki Kaisha Toshiba
InventorsWataru Saito, Ichiro Omura
Estimating the term…
A nitride semiconductor device according to one embodiment of the present invention includes: a non-doped first aluminum gallium nitride (AlxGa1-xN (0≦x≦1)) layer which is formed as a channel layer; a non-doped or n type second aluminum gallium nitride (AlyGa1-yN (0≦y≦1, x <y)) layer which is formed on the first aluminum gallium nitride layer as a barrier layer; an aluminum nitride (AlN) film which is formed on the second aluminum gallium nitride layer as a gate insulating film lower layer; an aluminum oxide (AL2O3) film which is formed on the aluminum nitride film as a gate insulating film upper layer; a source electrode and a drain electrode which are formed as first and second main electrodes to be electrically connected to the second aluminum gallium nitride layer, respectively; and a gate electrode which is formed on the aluminum oxide film as a control electrode.
A nitride semiconductor device comprising:
A nitride semiconductor device comprising:
Dependencies are inferred from the claim text.