Method and apparatus for mounting and removing an electronic component

A removing method for an electronic component that uses a tool to remove an electronic component soldered to a substrate, the removing method comprising:

• raising a heating temperature of the tool, electronic component and the substrate up to a maximum heating temperature;
• moving the tool to a stopped position where the maximum heating temperature is achieved, such that the electronic component maintains contact with the substrate;
• moving the electronic component from the stopped position where the maximum heating temperature is achieved to a mounting height of the substrate through movement of the tool so that the tool receives the electronic component from the substrate;
• and
• preheating the tool and the substrate before the movement of the tool.

A removing method for an electronic component that uses a tool to remove an electronic component soldered to a substrate, the removing method comprising:

• raising a heating temperature of the tool, electronic component and the substrate up to a maximum heating temperature;
• moving the tool to a stopped position where the maximum heating temperature is achieved, such that the electronic component maintains contact with the substrate;
• and
• moving the electronic component from the stopped position to a mounting height of the substrate through movement of the tool so that the tool receives the electronic component from the substrate.