Imaging module for optical reader
AssigneeHand Held Products, Inc.
InventorsCharles P. Barber, Carl W. Gerst, III, Vivian L. Hunter, Melvin D. McCall, Bruce L. Hahn
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AssigneeHand Held Products, Inc.
InventorsCharles P. Barber, Carl W. Gerst, III, Vivian L. Hunter, Melvin D. McCall, Bruce L. Hahn
Estimating the term…
The present invention relates to an apparatus packaging components of an optical reading device which may include illumination optical elements, receive optical elements, and signal processing elements. In one embodiment a single circuit board can carry multiple elements such as an image sensor together with illumination elements. In one embodiment, a control circuit can be provided that is coupled to a light source and an image sensor.
An optical reader comprising:
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An optical reader comprising:
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An optical reader comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Photodetector array or CCD scanning: including a diffuser for diffusing the light from the light source to create substantially uniform…
Fixed beam scanning: photodetector array or CCD scanning
Photodetector array or CCD scanning: light sources
Further details of bar or optical code scanning devices: constructional details of hand-held scanners
Term ended 22 Feb 2020 (estimated)
The present invention relates to optical reading devices in general and in particular to an apparatus for elements of an optical reader.
Currently available optical readers include illumination elements, electronic signal processing, image capture and decoding circuitry that are carried by more than one circuit board. For, example, shown in U.S. Pat. No. 5,780,834 is an optical reader having numerous circuit boards, including an LED board for carrying illumination LEDs, an “imaging board” carrying an image sensor and circuitry for processing signals generated from the image sensor, and a “mother board” carrying image capture and decoding circuitry.
Assembly of the multiple circuit board arrangement of the prior art is time consuming and expensive. Assembly of a prior art reader requires mounting of separate circuit boards to separate internal structures of a reader, and providing electrical connection between the multiple circuit boards. In addition adding to being difficult to assemble, the multiple circuit board design imposes size requirements on the optical reader housing in which the electrical components are to be integrated.
For a fuller understanding of the nature and objects of the invention, reference should be made to the following detailed description of a preferred mode of practicing the invention, read in connection with the accompanying drawings, in which:
FIG. 1A is a front perspective assembly diagram illustrating assembly of an image capture module according to the invention;
FIG. 1B is a rear perspective assembly diagram illustrating assembly of an image capture module according to the invention;
According to its major aspects and broadly stated the present invention is a module for packaging optical illumination, optical receive, and electrical signal processing components of an optical reader.
The module includes a frame which carries a printed circuit board, preferably a printed circuit board (PCB) and various optical components. In one embodiment, the frame includes a back plate having a retainer for receiving an optical lens barrel, and a recess for receiving and aligning an image sensor which is carried by the PCB. The frame may also include resilient fingers which enable the frame to receive certain optical components of the module in an adhesiveless snap-fitting arrangement.
According to a preferred assembly method for assembling the module, the PCB is first mounted onto the frame's back plate such that the image sensor of the PCB is received and aligned by the recess of the back plate. Next, illumination and aiming LEDs are soldered to the PCB to mount the LEDs. As a space conserving measure, the LEDs may be mounted so that a portion of rear surfaces of the illumination LEDs oppose a portion of the top surface of the image sensor when mounted.